Metal core PCB
Capability
| Metal core PCB Capability | |||
| Item | Technical specification | ||
| Standard | Advanced | ||
| Board thickness | Maximum (mm) | 3.0 | 5.0 |
| Panel size | Maximum (mm) | 600×1170 | / |
| Layer count | Aluminum PCB | 1-12L | 16 L |
| Copper PCB | 1-12L | 16 L | |
| Iron PCB | 1 | / | |
| ceramics PCB | 1-4 | / | |
| Thermal Conductivity | Aluminum PCB(w/m.k) | 0.8 to 12 | |
| Copper PCB(w/m.k) | 2.0-378 | / | |
| ceramics PCB(w/m.k) | 24 | ||
| Drilling | Minimum drill diameter (mm) | 1.0 | 0.8 |
| 2 Layer ALPCB Via | 0.3 | / | |
| Lines/spaces | Minimum | 0.2mm/0.2mm | 0.15mm/0.15mm |
| Material | Chao Shun(CCAF)(China) | Yes | / |
| Hua Dian(China) | Yes | / | |
| Chin Shi(TaiWan) | Yes | / | |
| Ventec(TaiWang) | Yes | / | |
| ITEQ(Tai Wan) | Yes | / | |
| ShengYi(China) | Yes | / | |
| Laird(US) | Yes | / | |
| Bergquist(US) | Yes | / | |
| Other brand per customer | Yes | / | |
| Final finishing | HASL Lead Free | Yes | / |
| HASL | Yes | / | |
| ENIG | Yes | / | |
| ENIPIG | Yes | / | |
| OSP | Yes | / | |
| Immersion Silver | Yes | / | |
| Immersion Tin | / | YES | |