What is aluminium pcb manufacturing process?
The manufacturing process for aluminum PCBs (also known as metal-core PCBs or MCPCBs) involves several steps:
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The first step is to design the PCB using computer-aided design (CAD) software. The design includes the placement of components, routing of traces, and selection of materials.
- Substrate preparation:
The aluminum substrate is cut to the desired size and shape. The surface of the substrate is then cleaned and roughened to improve adhesion.
- Dielectric layer application:
A layer of dielectric material is applied to the surface of the aluminum substrate. This layer provides electrical insulation and helps to improve thermal conductivity.
- Circuit printing:
The circuit pattern is printed onto the dielectric layer using a process called screen printing or photoengraving. The circuit pattern includes the conductive traces and pads for component attachment.
The excess metal is removed from the aluminum substrate using an etching process. This leaves only the desired circuit pattern on the substrate.
- Drilling and routing:
Holes are drilled into the substrate for component attachment and routing of traces. The substrate is then routed to the final shape and size.
- Surface finish:
A surface finish is applied to the exposed metal to protect against oxidation and improve solderability.
The PCB is tested to ensure that it meets the required specifications for electrical performance.
Components are attached to the PCB using soldering or other methods.
- Inspection and quality control:
The finished PCB is inspected and tested to ensure that it meets the required quality standards.
The manufacturing process of aluminum substrate involves the following steps:
- Preparation of the substrate material:
The first step is to select the appropriate material for the substrate. Aluminum is a popular choice due to its high thermal conductivity and low cost. The aluminum sheet is then cleaned and prepared for the next step.
- Application of the dielectric layer:
A dielectric layer is applied to the aluminum sheet to insulate it from the circuitry that will be applied later. This layer is usually made of a ceramic material that is applied using a screen printing process.
- Application of the circuitry:
The circuitry is applied to the dielectric layer using a photolithography process. This involves applying a photosensitive material to the dielectric layer, exposing it to light through a mask, and then developing it to create the circuit pattern.
The aluminum substrate is then etched to remove any excess material and create the desired circuit pattern. This is done using a chemical etching process that removes the exposed aluminum.
The circuitry is then plated with a layer of copper to improve its conductivity and durability. This is done using an electroplating process.
The final step is to add any necessary finishing touches, such as a solder mask or a silkscreen layer. This is done using a variety of processes, including screen printing, thermal curing, and UV exposure.
Once the aluminum substrate has been manufactured, it can be used in a variety of electronic applications, including LED lighting, power supplies, and computer components.
What is needed for the aluminum substrate manufacturing process
The aluminum substrate manufacturing process requires the following:
- Raw materials:
Aluminum ingots or sheets are required as the raw material for the manufacturing process.
- Melting furnace:
A melting furnace is used to melt the aluminum ingots or sheets.
- Casting machine:
A casting machine is used to pour the molten aluminum into a mold to create the substrate.
- Cooling system:
A cooling system is used to cool the substrate after it has been cast.
- Cutting machine:
A cutting machine is used to cut the substrate into the desired size and shape.
- Surface treatment:
The surface of the substrate may be treated with chemicals or coatings to improve its properties.
- Quality control:
Quality control measures are implemented throughout the manufacturing process to ensure that the substrate meets the required specifications and standards.
Applications Of aluminum pcb
The technology of the metal core PCB is ideal for its applications that generate immense heat and have difficulty being cool down using conventional fans or other cooling methods.
MCPCBs play an integral role to achieve a high illumination with fewer requirements than LEDs require.
The fabrication process of metal core PCB is helpful for the applications
Since the MCPCBs are most often used in LED technologies for producing a certain illumination the light-emitting diodes releases the heat in applications like:
– General lighting
– Automotive systems
– Industrial, telecom, power supplies, and high voltage regulators types of power converters
– Street safety lightings and streetlights
– Backlight applications
Military and aerospace are another two other sectors appropriate to utilize the benefits of metal core PCBs in their applications.
These sectors are quite sensitive and need to endure frequent thermal cycling, limits of temperature and humidity, along with repeated mechanical shocks.
The MCPCB deals according to the operational requirements only if better structural veracity and thermal conductivity enabling withstanding greater shocks.
The higher the conductivity of thermal, the better it is for the temperature distribution throughout the boards as it ensures a uniform for thermal cycling.
It also stops forming hot spots before near to the active components.
Other than these, MCPCB works great in solar panels and motion control applications.
The combination of a metal core with HDI PCB technology can create an advanced circuit technology including microwave RF PCB, flex PCB, and rigid-flex PCBs.
As the demand for PCBs is high due to the remarkable benefits, the metal core PCB is the most widely used one among all the others.
It ensures high circuitry density, thermal management, and enhanced reliability for enhanced performance.
Thermal conductivity of 2 Layers thermal Pad MPCB
Thermal pad area is 385 W/m.k
Capability of Metal core PCB
|Metal core PCB Capability|
|Board thickness||Maximum (mm)||3.0||5.0|
|Panel size||Maximum (mm)||600×1170||/|
|Layer count||Aluminum PCB||1-8L||10 L|
|Copper PCB||1-8L||10 L|
|Thermal Conductivity||Aluminum PCB(w/m.k)||0.8 to 12|
|Drilling||Minimum drill diameter (mm)||1.0||0.8|
|2 Layer ALPCB Via||0.3||/|
|Other brand per customer||Yes||/|
|Final finishing||HASL Lead Free||Yes||/|
2 Layers direct thermal path copper core pcb application
2 Layers direct thermal path copper core pcb are designed to dissipate heat generated by high-power LEDs,
which helps to increase the lifespan of the LED and improve its performance.
The aluminium base acts as a heat sink, which absorbs and dissipates the heat generated by the LED.
The 2 Layers direct thermal path copper core pcb is made by laminating a thin layer of copper onto an copper substrate.
The copper layer is then etched to create the circuit pattern.
2 Layers direct thermal path copper core pcb for LED lighting applications are available in various sizes and thicknesses, depending on the specific requirements of the application.
They are also available in single-sided, double-sided, and multi-layered configurations.
About Andwin MCPCB
Andwin Ciurcuits MCPCB davision set up on Feb. 2006.
Focus on providing metal core PCB for customer
In LED field and power supply field.
We can meet all your MCPCB manufacturing needs,
From single-sided Aluminum to
complex multilayered metal clad substrate PCBs
And from prototype through production.
The following is a list of the services and products