Alumina PCB

Custom Alumina ceramic PCB , delivery in 10 days
* Thermal conductivity up to 24 W/m.k
* Breakdown voltage 11KV

alumina pcb
Alumina PCB

In general, there are two types of the substrate is found in ceramic PCB.
One is Alumina and the one is Aluminum Nitride( AIN or ALN ).

Alumina is the most widespread material used in PCBs also the most effective to be used in the ceramic substrate.

It is also a cost-effective substrate and consists of major thermal conductivity.

Alumina PCB comprises ceramic material for multilayer packages.
It offers extraordinary strength, decent thermal conductivity,
Good hermeticity, outstanding electrical properties,
And high density to make the interconnections fruitful.

For using constantly for a long time, it has gone through several layers of experiment and developed for years.

The certain improvement in Alumina PCB has made it worthy of well-characterized performance with a proven track record.

alumina pcb
Components of Alumina PCB

Alumina PCB is also known as AI203 and metal base PCB.
This type of PCB utilizes dielectric thermally conductive and electrically insulated material among the aluminum metal along with the copper layer.

It can be used in any device that has heat dissipation and needs to maintain and control the temperature because Alumina PCB has thermal conductivity.
The construction of Alumina PCB contains three layers.

All the circuit layers are made of copper with a thickness of 1 to 20 oz.
insulating layer made of thermal conductivity, and electrically insulated material.

For making the base layer, it needs to use copper or aluminum metal substrate.

Alumina PCB stack up
alumina pcb stack up

The technical specification of Alumina PCB:

alumina techninal specification
What Makes Alumina PCB Worthy

The Alumina PCB is made of three types of Alumina Oxide,
such as 96% Alumina substrate, 99.5% Alumina substrate, and 99.6% Alumina substrate.
Each of these is highly effective to make different devices worthy.

alumina pcb

96% Alumina PCB substrate:

The 96% Alumina PCB substrate is a highly popular variant available in PCBs.
Most of the microelectronic applications require the Alumina PCB,
Because of the substrate materials.

The thick film substrate is the standard format required for these sorts of applications.
The 96% of Alumina substrate into the PCB is extensively used for building hybrid microelectronic circuits.

Due to the availability, minimal expanse, and high technical quality of 96% Alumina,
Makes it effective for making hybrid devices.

It also offers the best electrical insulating properties, mechanical power,
Good thermal conductivity, chemical resilience, and dimensional solidity.

99.5% Alumina Substrate: 

The 99.5% Alumina substrate is used in smaller grain size applications.
The applications that are not critical require this Alumina PCB.

The finish upon the surface of 99.5% has the ability to achieve a 2u-in max finish because it is a bit larger grain size.
The materials have less flexural strength, thermal conductivity, dielectrically strength as well as dielectric consistency.

One of the advantages is it can also be found in larger sizes and better thickness

99.6% Alumina Substrate: 

The 99.6% Alumina substrate is used for its standardized thin-film substrates.
It is best for using in sputtered, evaporated, and chemically vaporized deposited metals;
highly recommended in-circuit generation.

It has a high purity level and a smaller size grain enables the 99.6% Alumina to provide a smoother outcome without fewer surface defects.

It obtains less than 1u-in. 99.6 Alumina surface roughness.
This indicates high mechanical performance, low thermal conductivity, extra-ordinary electrical insulation, good dielectric properties, and good corrosion that give the most wear-resistant.

Manufacturing of Alumina PCB

Alumina is one of the important materials used during the manufacturing of Printed Circuit Boards.

The properties of the Alumina PCB materials are unambiguously diverse compared to the other alternatives available in the market.

It is made of ceramic components and the material properties are quite different from metals or fire-resistant materials.

This creates a difference in the manufacturing of Alumina PCB than the others.

Hence, the application of ceramic or Alumina in the PCB industry has some specific purpose to serve.

Where the other PCBs do not fit well, Alumina is the perfect alternative to choose.
The material used in Alumina PCB is strong and rigid that provides significant support to the components.

For mounting on the surface of the PCB, this is a perfect substitute to add.
The performance is high enough compared to the competitors including the thermal conductivity of the materials.
Temperature consistency is much higher compared to other materials.
The only drawback it holds is that the material sometimes becomes expensive mostly than the other usual materials used.

This often happens when it is used for some inevitable high-grade devices.  

The exceptional high-frequency performance and strong thermal dielectric with the low expansion is the reason that has made it the most common ceramic PCB and also the most demanding one. It is mostly used in the devices needed for cooling and heating, LED boards, medical circuits, sensor modules, and other high-frequency devices.

Advantages of Alumina PCB

Alumina Oxide is the most used ceramic material in ceramic PCBs and packages.
Using low volume Alumina PCB is perfect for creating samples, prototypes, and small volume programs that will be helpful for upgrading and accelerating company development reducing budget.

On the other hand, the medium to high volume solutions can be effective to ensure the competitive pricing of the manufacturing process so that the companies can alter the footprint and supply chain solution according to the production volume.

The most upgrading advantages once can have by using Alumina PCBs are the following:

  • Provides good electrical insulation
  • Ensures moderate mechanical strength in the ceramic circuit boards
  • Comes with excellent compressive strength
  • The operating temperature is comparatively high which is 350¡C to 1500¡C
  • Lower expansion coefficient (6-8 ppm/¡C) that leads to less stress on solder joints
  • Better thermal possessions (22-24 W/mK)
  • Greater performance in high-frequency applications
  • The materials are hard enough to guarantee moderate thermal conductivity
  • Alumina contributes to unmatched corrosion and wears resistance
  • Provides outstanding gliding properties and also low density
  • The package size becomes small because of the integration and possibilities in multilayer applications
  • Hermetic packages enable 0% of water absorption
  • Gives enough light reflection due to its white color contrast
  • Outgassing is restricted
  • Made of strong and rigid material that enhances durability
  • The price of the metal is comparatively less than the others

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