What is altium aluminum pcb stackup?
The stackup for an aluminum PCB in Altium typically includes the following layers:
- Top layer: This is the layer where the components are placed and soldered.
- Signal layer: This layer contains the traces that connect the components on the top layer.
- Power plane: This layer is used to provide power to the components on the top layer.
- Ground plane: This layer is used to provide a ground connection to the components on the top layer.
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Email is : mcpcb@andwinmcpcb.com
What Is altium aluminum pcb stackup?
Altium aluminum PCB stackup refers to the arrangement of layers in a printed circuit board (PCB) design that uses an aluminum core as a heat sink.
The stackup typically includes a top layer for component placement and soldering, a signal layer for connecting the components, a power plane for providing power,
a ground plane for providing a ground connection, and two thermal pads for providing a thermal connection between the components and the aluminum core.
The aluminum core is sandwiched between the thermal pads and provides a heat sink for the components.
The bottom layer is used to provide a ground connection to the components on the top layer. The specific arrangement of layers in the stackup can be customized based on the requirements of the design.
Types of altium aluminum pcb stackup
There are several types of Altium aluminum PCB stackup that can be used depending on the specific requirements of the design. Some of the common types are:
- Single-sided aluminum PCB stackup:
This stackup has a single layer of aluminum core and a single layer of copper on one side. - Double-sided aluminum PCB stackup:
This stackup has a double layer of aluminum core and two layers of copper, one on each side. - Multilayer aluminum PCB stackup:
This stackup has multiple layers of aluminum core and copper layers, with vias connecting the layers. - Hybrid aluminum PCB stackup:
This stackup combines aluminum core with other materials such as FR4 or ceramic, depending on the specific requirements of the design. - Metal-backed PCB stackup:
This stackup has a metal backing layer, such as aluminum or copper, that provides a heat sink for the components.
The specific type of Altium aluminum PCB stackup used will depend on the thermal and electrical requirements of the design, as well as the available space and budget for the project.
where is the altium aluminum pcb stackup used?
The Altium aluminum PCB stackup is used in the design and manufacturing of printed circuit boards (PCBs) that require high thermal conductivity and heat dissipation.
These types of PCBs are commonly used in power electronics, LED lighting, automotive electronics, and other applications where heat management is critical.
The aluminum PCB stackup typically consists of a layer of aluminum core material sandwiched between layers of copper and dielectric material.
This design allows for efficient heat transfer from the components to the aluminum core, which acts as a heat sink, dissipating the heat away from the board and preventing damage to the components.
Applications Of altium aluminum pcb stackup
The technology of the metal core PCB is ideal for its applications that generate immense heat and have difficulty being cool down using conventional fans or other cooling methods.
MCPCBs play an integral role to achieve a high illumination with fewer requirements than LEDs require.
The fabrication process of metal core PCB is helpful for the applications
Since the MCPCBs are most often used in LED technologies for producing a certain illumination the light-emitting diodes releases the heat in applications like:
– General lighting
– Automotive systems
– Industrial, telecom, power supplies, and high voltage regulators types of power converters
– Photovoltaic
– Street safety lightings and streetlights
– Backlight applications
Military and aerospace are another two other sectors appropriate to utilize the benefits of metal core PCBs in their applications.
These sectors are quite sensitive and need to endure frequent thermal cycling, limits of temperature and humidity, along with repeated mechanical shocks.
The MCPCB deals according to the operational requirements only if better structural veracity and thermal conductivity enabling withstanding greater shocks.
The higher the conductivity of thermal, the better it is for the temperature distribution throughout the boards as it ensures a uniform for thermal cycling.
It also stops forming hot spots before near to the active components.
Other than these, MCPCB works great in solar panels and motion control applications.
The combination of a metal core with HDI PCB technology can create an advanced circuit technology including microwave RF PCB, flex PCB, and rigid-flex PCBs.
As the demand for PCBs is high due to the remarkable benefits, the metal core PCB is the most widely used one among all the others.
It ensures high circuitry density, thermal management, and enhanced reliability for enhanced performance.
Thermal conductivity of 2 Layers thermal Pad MPCB
Thermal pad area is 385 W/m.k
Capability of Metal core PCB
| Metal core PCB Capability | |||
| Item | Technical specification | ||
| Standard | Advanced | ||
| Board thickness | Maximum (mm) | 3.0 | 5.0 |
| Panel size | Maximum (mm) | 600×1170 | / |
| Layer count | Aluminum PCB | 1-8L | 10 L |
| Copper PCB | 1-8L | 10 L | |
| Iron PCB | 1 | / | |
| ceramics PCB | 1-2 | / | |
| Thermal Conductivity | Aluminum PCB(w/m.k) | 0.8 to 12 | |
| Copper PCB(w/m.k) | 2.0-378 | / | |
| ceramics PCB(w/m.k) | 24 | ||
| Drilling | Minimum drill diameter (mm) | 1.0 | 0.8 |
| 2 Layer ALPCB Via | 0.3 | / | |
| Lines/spaces | Minimum | 0.2mm/0.2mm | 0.15mm/0.15mm |
| Material | Chao Shun(CCAF)(China) | Yes | / |
| Hua Dian(China) | Yes | / | |
| Chin Shi(TaiWan) | Yes | / | |
| Ventec(TaiWang) | Yes | / | |
| ITEQ(Tai Wan) | Yes | / | |
| ShengYi(China) | Yes | / | |
| Laird(US) | Yes | / | |
| Bergquist(US) | Yes | / | |
| Other brand per customer | Yes | / | |
| Final finishing | HASL Lead Free | Yes | / |
| HASL | Yes | / | |
| ENIG | Yes | / | |
| ENIPIG | Yes | / | |
| OSP | Yes | / | |
| Immersion Silver | Yes | / | |
| Immersion Tin | / | YES | |
2 Layers direct thermal path copper core pcb application
2 Layers direct thermal path copper core pcb are designed to dissipate heat generated by high-power LEDs,
which helps to increase the lifespan of the LED and improve its performance.
The aluminium base acts as a heat sink, which absorbs and dissipates the heat generated by the LED.
The 2 Layers direct thermal path copper core pcb is made by laminating a thin layer of copper onto an copper substrate.
The copper layer is then etched to create the circuit pattern.
2 Layers direct thermal path copper core pcb for LED lighting applications are available in various sizes and thicknesses, depending on the specific requirements of the application.
They are also available in single-sided, double-sided, and multi-layered configurations.
About Andwin MCPCB
Andwin Ciurcuits MCPCB davision set up on Feb. 2006.
Focus on providing metal core PCB for customer
In LED field and power supply field.
We can meet all your MCPCB manufacturing needs,
From single-sided Aluminum to
complex multilayered metal clad substrate PCBs
And from prototype through production.
The following is a list of the services and products
We offer:
• Metal Core PCB
• Thermal PAD MCPCB
• Aluminum PCB
• Copper based PCB
• Double sided Aluminum PCB
